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Tantalum targets, also known as tantalum planar sputtering targets, provide consistent and reproducible process performance with high thickness uniformity. The elimination of texture banding during fabrication produces a uniform microstructure, which delivers improved early-life stability and consistent-through-life sputter performance.
For tantalum target, we focus on to offer our customers with high purities ranging from 3N to 5N, fine and uniform grain size, elimination of strong texture banding, and early target life size stability.
Our tantalumplanar sputtering targets' metallic impurities and gaseous impurities have been measured by known authorities around the world.
Besides, we also offer program of recycling reclaimed scrap targets.
Application
Featuring excellent corrosion resistance, high temperature strength and good biocompatibility, tantalum target is used for lots of thin film applications such as a diffusion barrier material, memory devices, a gate electrode in MOSFET devices, a protective coating on print head devices and barrier metal for copper wiring device.
Chemical Composition of Tantalum Target
| Chemistry ppm | ||||||||||||
Description | Chief component | Impurities maximum | ||||||||||
Ta | Nb | Fe | Si | Ni | W | Mo | Ti | O | C | H | N | |
Ta1 | Remainder | 300 | 40 | 30 | 20 | 40 | 40 | 20 | 150 | 40 | 15 | 20 |
Ta2 | Remainder | 800 | 100 | 100 | 50 | 200 | 200 | 50 | 200 | 100 | 15 | 100 |
TaNb3 | Remainder | ＜35000 | 100 | 100 | 50 | 200 | 200 | 50 | 200 | 100 | 15 | 100 |
TaNb20 | Remainder | 170000- 230000 | 100 | 100 | 50 | 200 | 200 | 50 | 200 | 100 | 15 | 100 |
Ta2.5W | Remainder | 400 | 50 | 30 | 20 | 30000 | 60 | 20 | 150 | 50 | 15 | 60 |
Ta10W | Remainder | 400 | 50 | 30 | 20 | 110000 | 60 | 20 | 150 | 50 | 15 | 60 |
Package and Transportation
We pack tantalum target in plywood case and send them by ocean or air.
